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Product Introduction
Product Introduction
High purity, high sphericity, low oxygen content, excellent flowability, outstanding electrical and thermal conductivity, and controllable particle size.
Application areas
Additive manufacturing, electronic thermal management components, RF devices, heat dissipation parts, copper decorative and cultural‑heritage products, conductive pastes.
Enterprise Standard
Q/YXCL 001-202X “Spherical Pure Copper Powder for Additive Manufacturing,” with a purity of ≥99.9%, an oxygen content of ≤300 ppm, and a sphericity of ≥95%.
Pure copper (Cu) powder
Category:
European and American grade: Cu
Specifications and model numbers: 0–20 µm, 15–53 µm, 45–105 µm, 53–150 µm
Reference Standard: GB/T 5231-2022
Appearance: Nearly spherical
Oxygen content: ≤500 ppm
For more product details, please contact our product experts. We look forward to your call.
Product Introduction
Product Introduction
High purity, high sphericity, low oxygen content, excellent flowability, outstanding electrical and thermal conductivity, and controllable particle size.
Application areas
Additive manufacturing, electronic thermal management components, RF devices, heat dissipation parts, copper decorative and cultural‑heritage products, conductive pastes.
Enterprise Standard
Q/YXCL 001-202X “Spherical Pure Copper Powder for Additive Manufacturing,” with a purity of ≥99.9%, an oxygen content of ≤300 ppm, and a sphericity of ≥95%.
Product Inquiry
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Contact Information
Consultation Phone Number
Email address
Email address
Company Address
Room 509B, Floor 5, Building 30, Compound No. 26, Xihuan South Road, Beijing Economic-Technological Development Area
