From March 17 to 19, the 2026 TCT Asia 3D Printing & Additive Manufacturing Exhibition concluded successfully at the Shanghai National Exhibition and Convention Center. The event drew large crowds and vibrant technical exchanges, with Asia Materials showcasing its Cu-R01 infrared laser‑specific pure copper powder, high‑conductivity and high‑thermal‑conductivity pure copper powder, and a complete set of processes for copper alloy additive manufacturing. Over the three days, the company engaged in in-depth discussions with industry clients, R&D teams, and partners, and several groundbreaking achievements garnered widespread attention.

I. Launch of the New Cu-R01: Addressing Core Challenges in Pure Copper Additive Manufacturing

At this exhibition, Asia Materials officially launched Cu-R01 1064 nm infrared laser–specific pure copper powder , directly addressing the industry’s longstanding challenges of low infrared laser absorption and excessively rapid heat dissipation in traditional solid copper.

• R&D Breakthrough: By modifying the powder’s surface with micro‑ and nano‑scale wrinkled structures, laser coupling efficiency is significantly enhanced. The laser absorption rate remains stable at 35%. , compatible with mainstream models and capable of stable printing without the need for high‑power modifications.

• Application Prospects: Covering applications such as aerospace thermal management, electrical interconnections for new energy systems, liquid‑cooling heat dissipation in semiconductors, and high‑end communication components, it enables the efficient fabrication of complex flow channels, thin‑walled structures, and integrated monolithic parts, thereby advancing pure‑copper additive manufacturing from prototype development to mass production.

II. High-Conductivity, High-Thermal-Performance Pure Copper Powder: Data and On-Site Case Studies

Released simultaneously with the exhibition High-conductivity, high-thermal-conductivity pure copper powder Key parameters and real-world case studies, supported by empirical data, underpin industrial-scale applications:

• Purity ≥ 99.9%, with a precisely controllable particle size distribution, high sphericity, and excellent flowability, making it compatible with mainstream processes such as SLM and MIM.

• SLM‑processed state: electrical conductivity 99.5% IACS, thermal conductivity 420 W/(m·K); heat‑treated state: electrical conductivity 100.1% IACS, thermal conductivity 400 W/(m·K). Offers a balanced combination of mechanical properties and dimensional stability.

• On-site demonstrations of liquid-cooling thermal management modules, high-current copper busbars, and prototype components for aircraft engine combustion chambers and nozzles, providing a clear, end-to-end view of the entire manufacturing process—from powder to finished parts.

III. Additive Manufacturing of Copper Alloys: One-Stop Output of Process—Heat Treatment—Authoritative Performance Reports

Addressing the pain points of copper alloy additive manufacturing—“difficult-to-control processes, performance variability, and lack of standards”—Asia Materials offers an end-to-end solution:

• Optimization of key copper alloy powder formulations to meet diverse requirements, including high strength, high thermal conductivity, and corrosion resistance;

• Customized printing parameters and a proprietary heat‑treatment process effectively eliminate residual stresses, enhance densification, and improve mechanical consistency.

• Provides third-party, authoritative test reports covering key parameters such as tensile strength, yield strength, elongation, electrical and thermal conductivity, and fatigue performance, offering a reliable basis for product selection and certification.

During the exhibition, the technical team One-on-one in-depth explanation From material selection and process optimization to post‑processing and quality control, we provide end‑to‑end technical support, helping customers swiftly implement copper‑based additive manufacturing projects and earning widespread recognition.

IV. The Excitement Never Stops: See you at Booth B029 at the Powder Metallurgy Exhibition, March 24–26.

Though TCT has come to a close, innovation never stops. March 24–26 , The 18th China International Powder Metallurgy and Cemented Carbide Exhibition (PM CHINA 2026) will be held at the Shanghai National Exhibition and Convention Center, with Asia Materials once again in attendance. Booth B029.

At this year’s TCT show, Asia Materials is driving new momentum in the copper-based additive manufacturing and powder metallurgy industries, with material innovation at its core and process implementation as its guiding principle. We extend our heartfelt thanks to all our customers and partners for their support. Join us from March 24–26 at Booth B029 to discuss material upgrades and emerging industry opportunities!