Asia New Materials (Beijing) Co., Ltd. (hereinafter referred to as “Asia Materials”) cordially invites you to attend the “TCT Asia 2026 Asia 3D Printing and Additive Manufacturing Exhibition,” where we will together usher in a new chapter in the field of additive manufacturing materials. The exhibition will be grandly held from March 17 to 19, 2026, at the National Exhibition and Convention Center in Shanghai. We look forward to welcoming you at Booth 7H103 in Hall 7.1.

Asia Materials has always upheld the corporate mission of “scaling the heights of materials science.” At this exhibition, it proudly unveiled a milestone new product to users worldwide— “Cu-R01 1064nm infrared laser–specific pure copper powder.” This product has successfully increased the laser absorption rate to 35% , the print density reaches 98% In summary, this breakthrough has simultaneously addressed the industry’s longstanding challenges—namely, the low infrared laser absorption and high forming difficulty associated with conventional pure copper powders—thereby opening up entirely new possibilities for the application of laser powder bed fusion (LPBF) technology in the fabrication of high-performance pure copper components.

A sneak peek at the key highlights

01 Global debut of a new product, leading technological innovation

Higher—Cu-HC high-conductivity, high-thermal-conductivity pure copper powder : Developed specifically for applications demanding ultimate electrical‑thermal performance. Its SLM‑fabricated form boasts an electrical conductivity of up to 99.5% IACS and a thermal conductivity exceeding 420 W/(m·K); after heat treatment, its electrical conductivity can further reach 100.1% IACS, while its thermal conductivity remains stable at 405 W/(m·K), making it an ideal material for power electronics and high‑end thermal management.

Broader—Cu-R01 Pure Copper Powder for Infrared Lasers: Optimized for mainstream 1064 nm wavelength lasers, Increase micro- and nano-scale wrinkles on the powder surface. Enhance absorption efficiency, ensure a more stable printing process and more efficient energy utilization, and achieve high‑quality fabrication of complex, precision‑engineered pure copper components.

Finer—submicron/nanometer spherical pure copper powder: It meets the stringent particle-size requirements of cutting-edge fields such as micro- and nano-scale 3D printing, electronic pastes, and advanced catalysis.

02 Technical Deep-Dive Workshop (March 17, 1:30 PM)

We will host a dedicated press conference on the first afternoon of the exhibition, during which technical experts will provide an in-depth analysis:

Part 01: The R&D journey, performance advantages, and application prospects of the new Cu-R01 product.

Part 02: Comprehensive performance data and typical application cases of high‑conductivity, high‑thermal‑conductivity pure copper powder.

Part 03: Comprehensive additive manufacturing process flows, heat treatment techniques, and authoritative reports on the mechanical, electrical, and thermal‑conductivity properties of key copper alloy materials (such as CuCrZr, CuCrNb, CuSn12Ni2, etc.).

Four major material systems, with complete solutions showcased on-site.

At this exhibition, Asia Materials will systematically showcase a comprehensive materials portfolio tailored for additive manufacturing:

Pure Copper Series: Covering T2 copper, Cu‑HC (high conductivity), Cu‑HP (ultra‑pure, ≥99.999%), Cu‑ODS (oxide dispersion‑strengthened), and ultrafine copper powders, it meets diverse requirements ranging from structural components to functional parts.

Copper Alloy Series: These include the high‑strength, highly conductive CuCrZr series and CuCrNb‑42, the wear‑resistant CuNi2SiCr, as well as specialized alloys such as CuNi30, CuSn12Ni2, and CuNi15Sn8, offering a wide range of performance characteristics.

Titanium and Titanium Alloy Series: From the classic TC4 and TC11 alloys to high‑temperature titanium alloys such as Ti60 and Ti600, as well as intermetallic compounds like Ti2AlNb and TiAl4822, and functional materials like NiTi50 (a shape‑memory alloy), our product portfolio comprehensively covers high‑end applications in aerospace, medical implants, and other fields.

Special Alloy Powder Series: For example, high-damping materials such as M2052, as well as refractory metals like chromium (Cr), vanadium (V), tungsten–molybdenum (W–Mo), and tungsten–rhenium (W–Re), along with specialty alloy powders, are expanding the frontiers of additive manufacturing.

Of particular note, we will showcase on-site a range of finished products manufactured via 3D printing using our proprietary copper alloy powders, including:

Aerospace field: Key components such as the engine combustion chamber and the exhaust nozzle.

High-end industrial and electronics sectors: High-efficiency liquid-cooling thermal management modules, high-current copper busbars, and more.

These physical samples vividly demonstrate how Asia Materials’ powders are transformed into high-performance end products through advanced additive manufacturing processes.

Join us in Hall 7, Room 7H103, to co‑create the future of additive manufacturing!

We have prepared cutting-edge technologies, innovative products, and comprehensive solutions, and look forward to meeting you in person to explore opportunities for collaboration. All visitors to our booth will receive a beautifully customized gift—while supplies last, first come, first served!

From March 17 to 19, 2026, at the Shanghai National Exhibition and Convention Center, Asia Materials will be there—don’t miss it! Join us in witnessing the groundbreaking moment of pure copper additive manufacturing.