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Asia Materials Breaks Through Technical Barriers Again: 60 ppm Low-Oxygen Pure Copper Powder, with All-Dimensional Performance Empowering High-End Manufacturing
Release date:
2025-11-21
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Abstract
Pure copper powder, with its excellent electrical and thermal conductivity and superior ductility, is a core material in high-end fields such as electronics, electrical engineering, and aerospace. Recently, Asia New Materials (Beijing) Co., Ltd. (hereinafter referred to as “Asia Materials”) has announced a major technological breakthrough: its independently developed pure copper powder, after rigorous testing, boasts an oxygen content as low as 60 ppm—far below industry standards. Coupled with a uniform particle size distribution, outstanding density, and exceptional flowability, it leads the industry with all‑round, cutting‑edge performance, injecting strong momentum into high‑end manufacturing.
Oxygen content is the “lifeline” of pure copper powder performance. Excess oxygen can form cuprous oxide impurities within the powder, which not only hinder electron transport and reduce electrical and thermal conductivity but also lead to defects such as porosity and spatter in 3D-printed parts; in severe cases, this may even prevent forming altogether, thereby compromising product reliability. By optimizing the vacuum atomization powder‑making process and precisely controlling the smelting atmosphere and atomization parameters, Asia Materials has reduced oxygen content to an exact 60 ppm—far below the current standard for 3D‑printing copper powders (≤500 ppm)—while simultaneously achieving ultra‑high purity exceeding 99.95%, thus ensuring material stability from the very source.
This pure copper powder also boasts outstanding powder‑level performance: in this batch, the particle size distribution is uniform, with D10 = 12.11 μm, D50 = 33.5 μm, and D90 = 57.97 μm, making it ideally suited to 3D printing requirements. Its tapped density is 5.88 g/cm³ and its loose packing density is 5.00 g/cm³, demonstrating excellent bulk density. Flowability is just 20 s/50 g, ensuring excellent fillability and enhancing both printing efficiency and the density of the final part. Superior flowability ensures smooth, unobstructed powder spreading and conveying, significantly boosting printing throughput while minimizing build‑related defects.
Recently, our company has conducted powder‑printing data validation on pure copper powder. At present, its electrical conductivity can reach as high as 99.54 IACS%. Stay tuned! In the future, Asia Materials will continue to deepen its commitment to materials innovation, providing higher‑quality product solutions to help various industries achieve high‑end upgrades.
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